Develops processors and computing platforms designed for embodied AI.
Beijing, ChinaAIFounded 2022
2 sources · checked 1 time, last 1h ago
Developing: it holds up against its sources so far, and firms up as more reporting lands.
The sources do not state the amounts of either newly disclosed round. The reported RMB 2.5 billion is cumulative 2026 financing, not the amount of this financing.
| Round | Amount | Announced | Lead | Buzz |
|---|---|---|---|---|
| Series B Pre-B+ and Series B | n/a | 2026-10-22 | Beijing Artificial Intelligence Industry Investment Fund | 2 outlets. #113 in Trending |
2 sources · checked 1 time, last 1h ago [ DEVELOPING ] Developing: it holds up against its sources so far, and firms up as more reporting lands. read against 2 sources
The sources do not state the amounts of either newly disclosed round. The reported RMB 2.5 billion is cumulative 2026 financing, not the amount of this financing. [ BUILT WITH ]·[ SEARCH ]found by Firecrawl search·[ SCRAPE ]2 pages read: eu.36kr.com, techstartups.com·[ JSON ]round read into a schema, with the sentence that states it·[ VERIFY ]correctedchecked against 2 sources·[ AGENT ]company research by the Firecrawl agent | ||||
| EARLIER ROUNDS FROM COMPANY RESEARCH · DEVELOPING | ||||
| Pre-B round | over RMB 800 million | 2026-02 | not stated | |
Huixi builds high-performance processors, modules, software toolchains and foundation-model solutions for robot makers and other embodied-AI deployments.
Real-world robots need low-latency, reliable and power-efficient computing, and Huixi says its RPU, RISE and RhinoVLA stack is designed to move models from development into mass-produced products. The financing matters because Huixi says its R1-based platform has reached mass production in the AGIBOT G2 and that its latest Pre-B+ and B rounds brought 2026 cumulative equity financing above RMB 2.5 billion to fund next-generation chips and scale delivery.
Checked against 15 sources yesterday