Every round on record, with the sources behind each and the investors on them.
Develops die-to-die, chip-to-chip, and rack-to-rack PHY technology
eliyan.comLinkedInSanta Clara, California, USAAIFounded 2021
2 sources
Developing: it holds up against its sources so far, and firms up as more reporting lands.
The page is marked Published 2024-10-09, but the company's dateline states March 25, 2024; the dateline fixes the announcement day.
| Round | Amount | Announced | Lead | Buzz |
|---|---|---|---|---|
| Series B [ HISTORY ]: An earlier round, from the company's own announcement, found while researching the company. Checked like any round, but not new, so it stays out of the daily feed and alerts; a date range shows it. | $60M | 2024-03-25 | Samsung Catalyst Fund, Tiger Global Management | No recent discussion |
2 sources [ DEVELOPING ] Developing: it holds up against its sources so far, and firms up as more reporting lands. read against 1 of 2 sources The page is marked Published 2024-10-09, but the company's dateline states March 25, 2024; the dateline fixes the announcement day. | ||||
Eliyan builds die-to-die, chip-to-chip and rack-to-rack interconnect PHYs and chiplets that help AI, cloud and high-performance-computing system makers move data faster with less power.
Eliyan targets the memory and I/O walls that constrain AI and multi-die systems, and says NuLink can deliver up to four times the bandwidth and twice the power efficiency of alternatives while supporting standard packaging. Its $145 million Series C, led by Seligman Ventures at a $1 billion valuation, is funding expansion of electrical and optical interconnect development, ecosystem partnerships and manufacturing as hyperscale, AI-accelerator, memory and infrastructure customers evaluate or deploy the technology.
Checked against 10 sources today
Also named as backers in company research: Tracker Capital Management, Celesta Capital, Micron Ventures, VentureTech Alliance, AMD, Arm, Coherent, Meta, Cisco Investments, Lumentum, Seligman Ventures